Intel’s next-gen 52-core Nova Lake CPU could pull up to 474W — high-end LGA1954 motherboards may need three 8-pin power connectors to feed the monster

Intel is expected to push the boundaries on power draw with its upcoming Nova Lake series processors, which will rival the best CPUs. According to newly leaked information, the flagship 52-core desktop variant is expected to feature a dual-compute tile architecture with a massive PL2 limit of 474W. The information was shared by LC Tech Leaks and confirmed by Jaykihn, who has a pretty solid track record with Intel hardware.

PL2, or Power Limit 2, represents the maximum power a CPU can draw during short boost periods. That said, a PL2 target of 474W remains quite demanding, although a previous rumor suggests Intel may also have a PL4 emergency power limit over 700W. It is important to note that these power limits may only apply to the top-end models with the dual-tile architecture.

Additionally, the leak also sheds light on the upcoming platform, including the previously rumored LGA1954 socket. We already know that Nova Lake-S will require a new generation of motherboards. Motherboard vendors are expected to classify their boards by sustained PL1 power levels, with configurations for 35W, 65W, 125W, and 175W CPUs. Enthusiast-grade motherboards, likely the Z990 series, are also rumored to feature three EPS 8-pin CPU power connectors instead of the traditional two. While vendors will have the option to include a third connector, its primary purpose would be to support extreme overclocking and would not affect the CPU’s rated performance profile.

The upcoming Nova Lake-S lineup is expected to carry the ‘Core Ultra 400S’ moniker and will be Intel’s biggest desktop CPU overhaul in years. We’ve previously reported leaked specifications indicating configurations ranging from 6 to 52 cores, with support for DDR5-8000 memory. The flagship 52-core model is expected to feature 16 performance cores, 32 efficiency cores, and a new Big Last Level Cache (bLLC) design to take on AMD’s 3D V-Cache gaming dominance. The company is also rumored to introduce integrated Xe3 graphics, Thunderbolt 5, PCIe 5.0 connectivity, and an upgraded NPU for AI workloads.

While these specifications are unconfirmed, it is clear that Intel is targeting substantial gains in gaming, multi-threaded performance, and overall platform capabilities with its next-gen processors.